Flip chip light emitting diode packaging structure

Patent metadata

Field	Value
Publication number	US-9147809-B1
Application number	US-201514686114-A
Country	US
Kind code	B1
Filing date	Apr 14, 2015
Priority date	Sep 3, 2014
Publication date	Sep 29, 2015
Grant date	Sep 29, 2015

Abstract

A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.

First claim

What is claimed is:

1. A flip chip light emitting diode (LED) packaging structure, comprising:
a substrate including a first electrode and a second electrode;
an LED chip, wherein the LED chip having a P electrode and an N electrode; and
wherein the first electrode and the second electrode extends through a top side of the substrate and a bottom side of the substrate, the first electrode further comprises a first protrusion located on the top surface of the substrate, the second electrode further comprises a second protrusion located on the top surface of the substrate; and
wherein the P electrode includes a conductive plate, the P electrode and N electrode are fixed to the first protrusion and the second protrusion through a solder, a bottom edge of the conductive plate and the N electrode is beyond a top edge of the first protrusion and the second protrusion.

2. The flip chip LED packaging structure of claim 1 , wherein the first electrode further comprises a first welding portion located on a bottom surface of the substrate, a first connecting portion coupled with the first welding portion and the first protrusion and embedded in the substrate.

3. The flip chip LED packaging structure of claim 2 , a longitudinal section of the first welding portion and the first protrusion and the first connecting portion is rectangular.

4. The flip chip LED packaging structure of claim 3 , wherein an area of a bottom surface of the first welding portion is greater than a top surface of the first protrusion.

5. The flip chip LED packaging structure of claim 1 , wherein the second electrode further comprises a second welding portion located on a bottom surface of the substrate, a second connecting portion coupled with the second welding portion and the second protrusion and embedded in the substrate.

6. The flip chip LED packaging structure of claim 5 , wherein a longitudinal section of the second welding portion, the second protrusion and the second connecting portion is rectangular.

7. The flip chip LED packaging structure of claim 6 , wherein an area of a bottom surface of the second welding portion is greater than a top surface of the second protrusion.

8. The flip chip LED packaging structure of claim 1 , wherein an encapsulation layer is further included, the encapsulation layer is made of glue and phosphors and cover the LED chip therein.

9. The flip chip LED packaging structure of claim 1 , wherein the substrate is made of insulation material.

10. The flip chip LED packaging structure of claim 1 , wherein the P electrode and the N electrode are made of mental material.

11. The flip chip LED packaging structure of claim 1 , wherein the first electrode and the second electrode are made of thermal conductive material.

12. The flip chip LED packaging structure of claim 1 , wherein the sum of the area of the top surface of the first protrusion and the second protrusion is smaller than that of the area of the bottom surface of the conductive plate and the N electrode.

13. The flip chip LED packaging structure of claim 1 , wherein an end of the first protrusion forms a first rake surface, and an end of the second protrusion forms a second rake surface.

Assignees

• Advanced Optoelectronic Tech

Inventors

• Lin Hou-Te
• Chang Chao-Hsiung
• Chen Pin-Chuan
• Chen Lung-Hsin

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10H20/8585

  being an interconnection · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/853

  characterised by their shape · CPC title