SiC semiconductor device
US-12080760-B2 · Sep 3, 2024 · US
US9147758B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9147758-B2 |
| Application number | US-201414570610-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 15, 2014 |
| Priority date | Dec 17, 2013 |
| Publication date | Sep 29, 2015 |
| Grant date | Sep 29, 2015 |
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A semiconductor device includes a front surface electrode, a back surface electrode and a semiconductor substrate in which an IGBT and a diode are formed. An outer peripheral back surface p-type region, an outer peripheral back surface n-type region, and an outer peripheral low concentration n-type region are formed in an outer peripheral region. The outer peripheral back surface n-type region is formed on an end surface side of the semiconductor substrate with respect to the outer peripheral back surface p-type region. The outer peripheral low concentration n-type region separates the outer peripheral back surface p-type region and the outer peripheral back surface n-type region from a contact outer peripheral edge p-type region. A p-type impurity concentration in the outer peripheral back surface p-type region decreases toward the end surface. An n-type impurity concentration in the outer peripheral back surface n-type region increases toward the end surface.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a semiconductor substrate in which an IGBT and a diode are formed; a front surface electrode formed on a front surface of the semiconductor substrate; and a back surface electrode formed on a back surface of the semiconductor substrate, wherein an n-type emitter region of the IGBT, a p-type body region of the IGBT, and a p-type anode region of the diode are formed in a range exposed on the front surface in the semicon…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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