Low temperature sintering conductive metal film and preparation method thereof

Patent metadata

Field	Value
Publication number	US-9145503-B2
Application number	US-201113991130-A
Country	US
Kind code	B2
Filing date	Oct 20, 2011
Priority date	Dec 2, 2010
Publication date	Sep 29, 2015
Grant date	Sep 29, 2015

Abstract

A low-temperature sintered conductive metal ink and a method for preparing the same are provided. To be specific, the preparation method includes the following steps of: preparing the conductive film or pattern by printing a conductive metal ink including metal nanocolloids, metal salts, and polymers reacted with the metal salts and preparing the metal nanocolloids (step 1 ); preparing a mixture by mixing the metal salts and polymers (step 2 ); preparing the metal ink by stirring the metal nanocolloids and the metal salt/polymer mixture prepared at steps 1 and 2 (step 3 ); printing the metal ink prepared at step 3 (step 4 ); and drying and thermally treating a product printed at step 4 (step 5 ).

First claim

What is claimed is:

1. A conductive metal ink comprising a copper nanocolloid, a copper salt, and ethylene diamine that has been reacted with the copper salt.

2. The conductive metal ink as set forth in claim 1 , wherein the copper nanocolloid comprises copper particles.

3. The conductive metal ink as set forth in claim 2 , wherein a size of the copper particles is in a range of 1 to 500 nm.

4. The conductive metal ink as set forth in claim 1 , wherein the weight of copper in the copper nanocolloid is in the range of 0.1 to 80 wt %.

5. The conductive metal ink as set forth in claim 1 , wherein the copper salt is selected from the group consisting of a copper organic, copper nitrate, and copper chloride.

6. The conductive metal ink as set forth in claim 1 , further comprising a viscosity controlling agent.

7. A method for preparing a conductive metal ink, the method comprising:
preparing a copper nanocolloid;
preparing a mixture of a copper salt and ethylene diamine, which reacts with the copper salt; and
preparing the metal ink by stirring the copper nanocolloid and the mixture of the copper salt and ethylene diamine that has reacted with the copper salt.

8. The method for preparing the conductive metal ink as set forth in claim 7 , wherein the copper nanocolloid is prepared by means of an electrical wire explosion method.

9. The method for preparing the conductive metal ink as set forth in claim 7 , wherein in the mixture of the copper salt and the ethylene diamine, a concentration for each of the copper salt and the ethylene diamine is each in a range of 0.01 to 1 mol.

10. A method for preparing a conductive metal film, the method comprising:
applying the conductive metal ink of claim 1 to a substrate, wherein the applying is performed by a method selected from the group consisting of gravure printing, offset printing, inkjet printing, screen printing, imprint, and spin coating; and
thermally treating the substrate having the conductive metal ink thereon.

11. The method for preparing the conductive metal film as set forth in claim 10 , wherein the applying is performed in an atmosphere of gas selected from the group consisting of argon, hydrogen, and air.

12. The method for preparing the conductive metal film as set forth in claim 10 , wherein the thermal treatment is performed at a temperature of 100 to 500° C.

13. The method for preparing the conductive metal film as set forth in claim 10 , wherein a pattern is formed by the applying.

Assignees

• Yu Ji-Hun
• Yang Sangsun
• Kim Yong-Jin
• Korea Mach & Materials Inst

Inventors

• Yu Ji-Hun
• Yang Sangsun
• Kim Yong-Jin

Classifications

• B22F1/105

  containing inorganic lubricating or binding agents, e.g. metal salts · CPC title

• B22F1/0545

  Dispersions or suspensions of nanosized particles · CPC title

• B22F1/107

  containing organic material comprising solvents, e.g. for slip casting · CPC title

• B22F1/0074

  Operations & Transport · mapped topic

• B22F1/0022

  Operations & Transport · mapped topic