Silicon light trap devices
US-2015001665-A1 · Jan 1, 2015 · US
Cavity structures for MEMS devices
US9145292B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9145292-B2 |
| Application number | US-201414281251-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 19, 2014 |
| Priority date | Feb 22, 2011 |
| Publication date | Sep 29, 2015 |
| Grant date | Sep 29, 2015 |
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Abstract
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Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a MEMS-first approach, enabling use of a novel cavity sealing process. The impact and potential detrimental effects on the electrical devices by the MEMS processing are thereby reduced or eliminated. At the same time, a highly flexible solution is provided that enables implementation of a variety of measurement principles, including capacitive and piezoresistive. A variety of sensor applications can therefore be addressed with improved performance and quality while remaining cost-effective.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of forming a monolithic integrated sensor device comprising: forming a microelectromechanical system (MEMS) device on a non-silicon-on-insulator (non-SOI) substrate by: forming a monocrystalline sacrificial layer on only a first portion of the non-SOI substrate, depositing a first silicon layer on the monocrystalline sacrificial layer and on a second portion of the non-SOI substrate different from the first portion, forming a cavity in the mono…
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Electricity · mapped topic
- B81B7/008Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9145292B2 cover?
- Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a MEMS-first approach, enabling use of a novel cavity sealing process. The impact and potential detrimental effects on the electrical devices by the MEMS processing are thereby reduced or eliminated. At the same…
- Who is the assignee on this patent?
- Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification B81B7/008. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Sep 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).