Transdermal adhesive patch assembly with removable microneedle array and method of using same

US9144671B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9144671-B2
Application numberUS-201214352327-A
CountryUS
Kind codeB2
Filing dateDec 12, 2012
Priority dateDec 21, 2011
Publication dateSep 29, 2015
Grant dateSep 29, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A transdermal adhesive patch assembly and method of using same. The assembly can include a backing, and an adhesive and a matrix coupled to the backing. The matrix can include an active ingredient. The assembly can further include a microneedle array in at least partially overlapping relationship with the matrix; and a carrier that couples the microneedle array to the matrix opposite the backing, wherein the carrier and the microneedle array form a skin treatment assembly that, along with the matrix, can be located on a flap. The method can include adhering at least a portion of the adhesive to skin to form an anchor; applying pressure adjacent the microneedle array to treat an area of the skin; moving the flap away from the skin; removing the skin treatment assembly to expose the matrix; and replacing the flap to position the matrix over the treated area of the skin.

First claim

Opening claim text (preview).

What is claimed is: 1. A transdermal adhesive patch assembly, the assembly comprising: a backing having a first major surface and a second major surface; a skin-contact adhesive coupled to the second major surface of the backing; a matrix comprising an active ingredient, the matrix coupled to the second major surface of the backing; a microneedle array located in at least partially overlapping relationship with the matrix; and a carrier positioned to couple the microneedle array to the matrix opposite the backing, wherein the carrier and the microneedle array form a skin treatment assembly that is configured to be decoupled from the matrix, when desired, to expose the matrix; wherein a portion of the backing and at least a portion of the skin-contact adhesive extend beyond the skin treatment assembly in at least one direction to form an anchor, and wherein the matrix and the skin treatment assembly are located on a flap that is movable with respect to the anchor between a first position in which the flap is not folded back relative to the anchor and a second position in which the flap is folded back relative to the anchor. 2. The assembly of claim 1 , wherein the flap is movable with respect to the anchor when the anchor is coupled to skin between the first position in which at least one of the matrix and the microneedle array is in contact with skin, and the second position in which neither the matrix nor the microneedle array is in contact with the skin. 3. The assembly of claim 1 , wherein the matrix includes a first major surface coupled to the second major surface of the backing and a second major surface, and wherein the carrier is positioned to couple the microneedle array to the second major surface of the matrix. 4. The assembly of claim 1 , wherein the carrier includes the microneedle array. 5. The assembly of claim 1 , wherein the microneedle array and the carrier are adhesively coupled together, and wherein a coefficient of adhesion between the carrier and the matrix is less than a coefficient of adhesion between the matrix and the backing, and is less than a coefficient of adhesion between the carrier and the microneedle array. 6. The assembly of claim 1 , wherein the carrier is further coupled to the skin-contact adhesive. 7. The assembly of claim 6 , wherein a coefficient of adhesion between the carrier and the skin-contact adhesive is less than a coefficient of adhesion between the skin-contact adhesive and the backing. 8. The assembly of claim 1 , wherein the carrier includes release characteristics for at least one of the skin-contact adhesive and the matrix. 9. The assembly of claim 1 , wherein the carrier includes an extension that extends beyond an edge of the backing in a direction generally opposite the anchor. 10. The assembly of claim 9 , wherein the extension includes a tab that is folded back toward the backing. 11. The assembly of claim 9 , wherein the extension is a first extension and further comprising a second extension located on an opposite end of the carrier from the first extension, the first extension configured to facilitate moving the flap from the first position to the second position, and the second extension configured to facilitate decoupling the skin treatment assembly from the matrix. 12. The assembly of claim 11 , wherein the second extension includes a tab that is folded back toward the microneedle array to facilitate grasping. 13. The assembly of claim 12 , wherein the tab of the second extension extends at least partially over the microneedle array. 14. The assembly of claim 12 , wherein the tab of the second extension extends at least partially over the microneedle array and includes an aperture dimensioned to receive the microneedle array to allow the microneedle array to pass therethrough. 15. The assembly of claim 1 , further comprising a release liner coupled to the skin-contact adhesive opposite the backing and including a recess dimensioned to receive the microneedle array. 16. The assembly of claim 1 , wherein the assembly includes: a skin treatment configuration wherein the skin treatment assembly is coupled to the matrix, such that the matrix is at least partially covered by the skin treatment assembly, and a delivery configuration wherein the skin treatment assembly has been decoupled from the matrix to expose the matrix for delivery of the active ingredient. 17. The assembly of claim 1 , wherein the anchor surrounds the flap on all sides. 18. The assembly of claim 1 , wherein a portion of the skin-contact adhesive extends alongside the skin treatment assembly in the flap, such that when the microneedle array is positioned in contact with skin, at least a portion of the skin-contact adhesive in the flap is adhered to the skin. 19. The assembly of claim 1 , wherein a portion of the skin-contact adhesive extends alongside the matrix and the microneedle array in the flap, and wherein the carrier is positioned to cover the portion of the skin-contact adhesive that is located in the flap, such that when the microneedle array is positioned in contact with the skin, the skin-contact adhesive in the flap is not adhered to the skin. 20. A method of treating skin and applying an active ingredient transdermally, the method comprising: providing a transdermal adhesive patch assembly, the assembly comprising a backing having a first major surface and a second major surface, a skin-contact adhesive coupled to the second major surface of the backing, a matrix comprising an active ingredient, the matrix coupled to the second major surface of the backing, a microneedle array located in at least partially overlapping relationship with the matrix, and a carrier positioned to couple the microneedle array to the matrix opposite the backing, the carrier and the microneedle array forming a skin treatment assembly, adhering at least a portion of the skin-contact adhesive to the skin to form an anchor, wherein the matrix and the skin treatment assembly are located on a flap that is movable with respect to the anchor; applying pressure adjacent the microneedle array to treat an area of the skin; moving the flap away from the skin while the anchor remains adhered to the skin; removing the skin treatment assembly to expose the matrix; and replacing the flap to position the matrix in least partially overlapping relationship with the treated area of the skin.

Assignees

Inventors

Classifications

  • characterised by shape or structure; Details concerning release liner or backing; Refillable patches; User-activated patches · CPC title

  • Methods for using microneedles · CPC title

  • by using microneedles · CPC title

  • Transdermal patches having a drug layer or reservoir, and one or more separate drug-free skin-adhesive layers, e.g. between drug reservoir and skin, or surrounding the drug reservoir; Liquid-filled reservoir patches · CPC title

  • Drug applicators using microneedles · CPC title

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Frequently asked questions

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What does patent US9144671B2 cover?
A transdermal adhesive patch assembly and method of using same. The assembly can include a backing, and an adhesive and a matrix coupled to the backing. The matrix can include an active ingredient. The assembly can further include a microneedle array in at least partially overlapping relationship with the matrix; and a carrier that couples the microneedle array to the matrix opposite the backin…
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification A61M37/0015. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Sep 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).