Resist composition and pattern forming process
US-2024377730-A1 · Nov 14, 2024 · US
US9140989B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9140989-B2 |
| Application number | US-201214111021-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 11, 2012 |
| Priority date | Apr 12, 2011 |
| Publication date | Sep 22, 2015 |
| Grant date | Sep 22, 2015 |
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A material forms a pattern by applying a photosensitive composition to a base material and drying to form a photosensitive coating and performing exposure and development, and a method for forming the pattern. A photosensitive composition includes water-soluble organic particles, and a solvent, wherein the solvent is a poor solvent for the water-soluble organic particles. Preferably, the water-soluble organic particles of the photosensitive composition includes a polymer which contains a unit structure (A) for forming organic particles, a unit structure (B) for forming interparticle crosslinkage, and a unit structure (C) for imparting dispersibility, and the photosensitive composition further includes a photoacid generator. In addition, the water-soluble organic particles of the photosensitive composition includes a polymer which contains the unit structure (A) for forming organic particles, the unit structure (B) for forming interparticle crosslinkage, the unit structure (C) for imparting dispersibility, and a unit structure (D) having a photoacid generating group.
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The invention claimed is: 1. A photosensitive composition comprising: water-soluble organic particles; a solvent; and a photoacid generator wherein: the solvent is a poor solvent for the water-soluble organic particles; and the water-soluble organic particles include a polymer that contains a unit structure (A) for forming organic particles, a unit structure (B) for forming interparticle crosslinkage, and a unit structure (C) for imparting dispersibility. 2. The photosensitive composition according to claim 1 , wherein the water-soluble organic particles include a polymer which contains the unit structure (A) for forming organic particles, the unit structure (B) for forming interparticle crosslinkage, the unit structure (C) for imparting dispersibility, and a unit structure (D) having a photoacid generating group. 3. The photosensitive composition according to claim 1 , wherein a monomer forming the unit structure (A) is (meth)acrylic acid amide, N-alkyl(meth)acrylic acid amide, or N-aryl(meth)acrylic acid amide. 4. The photosensitive composition according to claim 1 , wherein a monomer forming the unit structure (B) is N-hydroxyalkyl(meth)acrylic acid amide, N-hydroxyaryl(meth)acrylic acid amide, N-alkoxyalkyl(meth)acrylic acid amide, N-alkoxyaryl(meth)acrylic acid amide, hydroxyalkyl(meth)acrylate, hydroxyaryl(meth)acrylate, alkoxyalkyl(meth)acrylate, or alkoxyaryl(meth)acrylate. 5. The photosensitive composition according to claim 1 , wherein a monomer forming the unit structure (C) is a compound obtained by esterifying (meth)acrylic acid using polyether. 6. The photosensitive composition according to claim 1 , wherein the water-soluble organic particles contain the unit structure (A), the unit structure (B), and the unit structure (C) at a molar ratio of 1:0.01 to 3.00:0.0001 to 0.1 (A:B:C). 7. The photosensitive composition according to claim 2 , wherein the water-soluble organic particles contain the unit structure (A), the unit structure (B), the unit structure (C), and the unit structure (D) at a molar ratio of 1:0.01 to 3.00:0.0001 to 0.1:0.1 to 3.00 (A:B:C:D). 8. The photosensitive composition according to claim 1 , wherein the poor solvent is a solvent including ether, ester, hydrocarbon, ketone, aldehyde, or alcohol. 9. The photosensitive composition according to claim 1 , wherein the poor solvent is a solvent including propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether, ethanol, propanol, isopropanol, or butanol. 10. A pattern forming method comprising: a step of applying the photosensitive composition according to claim 1 to a base material and drying to form a photosensitive coating; a step of exposing the coating to light through a mask; and a step of performing developing using a developer. 11. The pattern forming method according to claim 10 , further comprising a step of performing heating after the step of exposing. 12. The pattern forming method according to claim 10 , wherein the developer is water or an aqueous medium.
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