Connecting structure for a waveguide converter having a first waveguide substrate and a second converter substrate that are fixed to each other

Patent metadata

Field	Value
Publication number	US-9136576-B2
Application number	US-201013266909-A
Country	US
Kind code	B2
Filing date	Jan 15, 2010
Priority date	Apr 28, 2009
Publication date	Sep 15, 2015
Grant date	Sep 15, 2015

Abstract

A connecting structure of a waveguide converter includes a circuit substrate in which a hollow waveguide that propagates a high frequency signal is formed in a pierced manner; and an antenna substrate that is layered on the circuit substrate, and in which a converter that is arranged at a connecting point with the hollow waveguide and a strip line that extends from the converter and that propagates the high frequency signal are provided. A choke circuit to shield a leak of the high frequency signal is arranged around the hollow waveguide on a surface of the circuit substrate opposing to the antenna substrate so as to surround the hollow waveguide keeping a predetermined interval from the hollow waveguide, and the circuit substrate and the antenna substrate are fixed to each other by adhesive that is arranged at a position outside the choke circuit, between the substrates.

First claim

The invention claimed is:

1. A connecting structure of a waveguide converter, comprising:
a first substrate pierced by a hollow waveguide that propagates a high frequency signal;
a second substrate that is layered on the first substrate, an inner-surface conductive pattern being formed on the surface of the first substrate opposing the second substrate;
a high frequency module that inputs and outputs a high frequency signal is arranged on a side of the first substrate facing away from the second substrate;
an antenna converter is arranged on a side of the second substrate facing away from the first substrate and immediately adjacent to a connecting point with the hollow waveguide to propagate the high frequency signal through the hollow waveguide to and from the high frequency module; and
a transmission line that extends away from the antenna converter and the hollow waveguide and that propagates the high frequency signal, the transmission line is provided on the second substrate, wherein
a choke structure to shield a leak of the high frequency signal is arranged around the hollow waveguide on the surface of the first substrate opposing to the second substrate so as to surround the hollow waveguide keeping a predetermined interval from the hollow waveguide through the inner surface conductor pattern, and
the first substrate and the second substrate are fixed to each other by a fixing unit that is arranged at a position outside the choke structure between the first and second substrates.

2. The connecting structure of the waveguide converter according to claim 1 , wherein
the choke structure includes
the inner-surface conductive pattern being formed around the hollow waveguide on the surface of the first substrate opposing to the second substrate,
an outer-surface conductive pattern that is formed around the inner-surface conductive pattern leaving an interval therefrom,
a conductor opening that is formed between the inner-surface conductive pattern and the outer-surface conductive pattern, and at which dielectric is exposed,
an internal layer conductor that is formed at a position away from the conductor opening at a predetermined distance in a direction in which the first substrate is layered, and
a short stub dielectric transmission path that is formed by a plurality of through conductors that connect the internal layer conductor with the inner-surface conductive pattern and the outer-surface conductive pattern.

3. The connecting structure of the waveguide converter according to claim 1 , wherein
the first substrate and the second substrate are fabricated separately by independent processes to be fixed by the fixing unit.

4. The connecting structure of the waveguide converter according to claim 1 , wherein
plural sets of the hollow waveguide and the choke structure are arranged, and the fixing unit is arranged so as to surround the plural sets together.

5. The connecting structure of the waveguide converter according to claim 1 , wherein
the fixing unit is adhesive that is arranged at a position outside the choke structure so as to be sandwiched between the first substrate and the second substrate.

6. The connecting structure of the waveguide converter according to claim 5 , wherein
the adhesive is nonconductive adhesive.

7. The connecting structure of the waveguide converter according to claim 1 , wherein
the second substrate uses a core substrate whose thickness is controlled.

8. An antenna apparatus comprising:
a high frequency module that inputs and outputs a high frequency signal;
a circuit substrate pierced by a hollow waveguide that propagates the high frequency signal;
an antenna substrate layered on the circuit substrate, and the high frequency module is arranged on a side of the circuit substrate facing away from the antenna substrate, an inner-surface conductive pattern being formed on the surface of the circuit substrate opposing the antenna substrate;
an antenna converter provided on a side of the antenna substrate facing away from the circuit substrate and immediately adjacent to a connecting point with the hollow waveguide to propagate the high frequency signal to and from the high frequency module;
a transmission line that extends away from the converter and the hollow waveguide, the transmission line is provided on the antenna substrate and propagates the high frequency signal; and
an antenna device that is connected to the transmission line and is provided on the antenna substrate, wherein
a choke structure to shield a leak of the high frequency signal is arranged around the hollow waveguide on the surface of the circuit substrate opposing to the antenna substrate so as to surround the hollow waveguide keeping a predetermined interval from the hollow waveguide through the inner surface conductor pattern, and
the circuit substrate and the antenna substrate are fixed to each other by a fixing unit that is arranged at a position outside the choke structure, between the first and second substrates.

9. The antenna apparatus according to claim 8 , wherein
plural sets of the hollow waveguide and the choke structure are arranged, and the fixing unit is arranged so as to surround the plural sets together.

10. A manufacturing method of a waveguide converter, comprising:
fabricating a first substrate and a second substrate separately, the first substrate including a hollow waveguide that propagates a high frequency signal, a choke structure that is arranged around the hollow waveguide on the surface of the first substrate opposing the second substrate at a predetermined interval from the hollow waveguide so as to surround the hollow waveguide, and a surface conductive pattern formed on the surface of the first substrate opposing the second substrate has been inserted after, the second substrate including an antenna converter arranged at a connecting point with the hollow waveguide and a transmission path that extends from the converter and that propagates the high frequency signal;
laminating the first substrate and the second substrate in such a manner that the hollow waveguide and the converter are positioned so as to correspond with each other;
fixing the first substrate and the second substrate by adhesive that is sandwiched between the first and second substrates at a position outside the choke structure; and
arranging a high frequency module that inputs and outputs a high frequency signal on a side of the first substrate facing away from the second substrate, and arranging the antenna converter on a side of the second substrate facing away from the first substrate and immediately adjacent to the connecting point with the hollow waveguide to propagate the high frequency signal through the hollow waveguide to and from the high frequency module.

11. The manufacturing method of a waveguide converter according to claim 10 , wherein
the second substrate uses a core substrate whose thickness is controlled.

Assignees

• Hashimoto Minoru
• Udagawa Shigeo
• Mitsubishi Electric Corp

Inventors

• Hashimoto Minoru
• Udagawa Shigeo

Classifications

• H01P1/042

  Hollow waveguide joints · CPC title

• H01P5/107 Primary

  Hollow-waveguide/strip-line transitions · CPC title

• Y10T29/49018

  with other electrical component · CPC title