Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9136451B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136451-B2 |
| Application number | US-201313891014-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 9, 2013 |
| Priority date | Jun 29, 2011 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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Disclosed are a light emitting device package and a light unit including the same. The light emitting device package includes a body; a first lead frame having a first cavity in a first region of the body; a second lead frame having a second cavity in a second region of the body; a first bonding part adjacent to a first lateral side of the body and extended from the first cavity of the first lead frame; a second bonding part adjacent to a second lateral side of the body, which is opposite to the first lateral side of the body, and extended from the second cavity of the second lead frame; a first light emitting device in the first cavity; a second light emitting device in the second cavity; a third cavity adjacent to the first bonding part; a first protective device in the third cavity.
Opening claim text (preview).
What is claimed is: 1. A light emitting device package comprising: a body formed of an insulating material and having a recess; a first lead frame having a first cavity in the recess of the body; a second lead frame having a second cavity in the recess of the body; a first bonding part connected to the first lead frame on a bottom of the recess; a second bonding part connected to the second lead frame on a bottom of the recess; a first light emitting device in the first…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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