Electronic device package and fabricating method thereof
US-2024347575-A1 · Oct 17, 2024 · US
US9136290B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136290-B2 |
| Application number | US-201213416036-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 9, 2012 |
| Priority date | Sep 27, 2011 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face.
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What is claimed is: 1. A solid state imaging device, comprising: a sensor substrate having a first face, the first face including a first pixel and a second pixel; a microlens array substrate including first and second lenses, and first and and second regions, the first region being provided between the first lens and the second lens, and the second lens being provided between the first region and the second region; a first connection post having a first end and a second…
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