Electronic device package and fabricating method thereof
US-2024347575-A1 · Oct 17, 2024 · US
Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
US9136289B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136289-B2 |
| Application number | US-201113215340-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 23, 2011 |
| Priority date | Aug 23, 2011 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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- Title
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Abstract
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A camera module including a housing with embedded conductive traces that allow for an increase in usable surface area of a corresponding printed circuit board (PCB) or multi-layer substrate, a reduced overall thickness of the module, a reduction in tilt management of a lens element of the module, and a facilitation in alignment of the lens element relative to the image sensor. An image sensor is electrically interconnected to first portions of the conductive traces by way of a flip chip process, and then the housing may be mounted over the PCB so that second portions of the conductive traces interconnect with corresponding conductive pads on the PCB to electrically interconnect the image sensor die to the PCB. In one arrangement, another die may be electrically interconnected to the PCB so that as assembled, the die is disposed between the image sensor and the PCB.
First claim
Opening claim text (preview).
What is claimed is: 1. A camera module for use in electronic devices, comprising: a housing comprising generally opposing first and second ends, opposing first and second portions, wherein the first portion comprises the first end, an outer surface, an inner surface, and a first housing cavity that is surrounded by the inner surface, and wherein the second portion comprises the second end, an outer surface, an inner surface that includes a series of steps that progressively move c…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9136289B2 cover?
- A camera module including a housing with embedded conductive traces that allow for an increase in usable surface area of a corresponding printed circuit board (PCB) or multi-layer substrate, a reduced overall thickness of the module, a reduction in tilt management of a lens element of the module, and a facilitation in alignment of the lens element relative to the image sensor. An image sensor i…
- Who is the assignee on this patent?
- Tam Samuel, Flextronics Ap Llc
- What technology area does this patent fall under?
- Primary CPC classification H10F39/804. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).