Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Resin-encapsulated semiconductor device and method of manufacturing the same
US9136247B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136247-B2 |
| Application number | US-201514614283-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 4, 2015 |
| Priority date | Sep 24, 2012 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A resin-encapsulated semiconductor device is manufactured by mounting semiconductor elements on respective die pad portions of a frame. Electrodes on the surface of the semiconductor elements are wire bonded to lead portions of the frame. The die pad portions, semiconductor elements and lead portions are encapsulated with resin, leaving a bottom surface part of the lead portions exposed. The lead portions are partially cut by a rotary blade from an upper side of the resin to form concave parts in the lead portions, which are wet-etched to form exposed lead upper end parts. A plated layer is formed on the lead upper end parts and the lead bottom surface parts. The remaining parts of the lead portions with the plated layer are cut to separate the resin-encapsulated semiconductor device into individual pieces.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a resin-encapsulated semiconductor device, comprising: preparing one of a frame and an electroformed substrate, including a plurality of units each including a die pad portion and a plurality of lead portions disposed opposite to the die pad portion; mounting a semiconductor element on each of the die pad portions of the one of the frame and the electroformed substrate, and connecting the plurality of lead portions and electrodes…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W74/00Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9136247B2 cover?
- A resin-encapsulated semiconductor device is manufactured by mounting semiconductor elements on respective die pad portions of a frame. Electrodes on the surface of the semiconductor elements are wire bonded to lead portions of the frame. The die pad portions, semiconductor elements and lead portions are encapsulated with resin, leaving a bottom surface part of the lead portions exposed. The le…
- Who is the assignee on this patent?
- Seiko Instr Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W74/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).