Auxiliary joining agent and method for producing the same
US-2015096651-A1 · Apr 9, 2015 · US
Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US9136243B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136243-B2 |
| Application number | US-201414553782-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 25, 2014 |
| Priority date | Dec 3, 2013 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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Abstract
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A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
First claim
Opening claim text (preview).
What is claimed: 1. A method of determining a level of parallelism between a bonding tool and a support structure of a bonding machine, the method comprising the steps of: (a) positioning a contact portion of a calibration tool between the bonding tool and the support structure; (b) lowering the bonding tool to drive the contact portion of the calibration tool to a contact position within a bonding location of the support structure where the contact portion of the calibration to…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9136243B2 cover?
- A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the …
- Who is the assignee on this patent?
- Kulicke & Soffa Ind Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W72/072. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).