Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Methods of providing dielectric to conductor adhesion in package structures
US9136221B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136221-B2 |
| Application number | US-201213630500-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 28, 2012 |
| Priority date | Sep 28, 2012 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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Abstract
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Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a CVD dielectric material on a package dielectric material, and then forming a conductive material on the CVD dielectric material.
First claim
Opening claim text (preview).
What is claimed is: 1. A package structure comprising: a first CVD dielectric glue material disposed on a first dielectric build up material of a package structure wherein the first CVD dielectric glue material is a different material than the first dielectric build up material; a first opening formed through the first CVD dielectric glue material and through the first dielectric build up material; and a conductive material disposed on the first CVD dielectric glue material an…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9136221B2 cover?
- Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a CVD dielectric material on a package dielectric material, and then forming a conductive material on the CVD dielectric material.
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/685. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).