Substrate processing apparatus, substrate processing system, and maintenance method
US-2024339306-A1 · Oct 10, 2024 · US
Apparatus and method for treating substrate
US9136147B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136147-B2 |
| Application number | US-201213559838-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 27, 2012 |
| Priority date | Jul 29, 2011 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; and a pressing member configured to apply a force to the door so as to close the housing during the high pressure process.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus for treating a substrate, the apparatus comprising: a housing comprising an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; a pressing member configured to apply a force to the door so as to close the housing during the high pressure process; the pressing member includes,…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0462Primary
Electricity · mapped topic
Mechanical Engineering · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9136147B2 cover?
- Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a doo…
- Who is the assignee on this patent?
- Park Joo Jib, Kwon Oh Jin, Jang Sungho, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0462. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).