Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
US9130276B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9130276-B2 |
| Application number | US-201314088575-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 25, 2013 |
| Priority date | Dec 18, 2012 |
| Publication date | Sep 8, 2015 |
| Grant date | Sep 8, 2015 |
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Official abstract text for this publication.
An antenna device includes a substrate; a first ground element that is arranged on the substrate; an antenna element that is arranged on the substrate and extends from its first end positioned near a side edge of the first ground element to its second end positioned away from the side edge; and a non-feed element that is arranged on the substrate, connected to the first ground element, and insulated from the antenna element. The non-feed element extends from its first end portion positioned near the side edge of the first ground element to a bending portion in a direction away from the side edge and extends from the bending portion to its second end portion along the side edge. A portion between the bending portion and the second end portion of the non-feed element intersects with the antenna element.
Opening claim text (preview).
What is claimed is: 1. An antenna device comprising: a substrate; a first ground element that is arranged on the substrate; an antenna element that is arranged on the substrate and extends from its first end positioned near a side edge of the first ground element to its second end positioned away from the side edge; and a non-feed element that is arranged on the substrate, connected to the first ground element, and insulated from the antenna element; wherein the non-feed e…
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