Substrate processing apparatus and control method for a substrate processing apparatus
US-2024120204-A1 · Apr 11, 2024 · US
US9127361B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9127361-B2 |
| Application number | US-63251409-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 7, 2009 |
| Priority date | Dec 7, 2009 |
| Publication date | Sep 8, 2015 |
| Grant date | Sep 8, 2015 |
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A method of and a multiple zone pressure controller system for controlling the pressure of a gas or vapor flowing to at least two zones of a process tool such as a vacuum deposition chamber. The system comprises: at least two channels configured and arranged so as to provide the flow of the gas or vapor to corresponding zones of the process tool, each channel including a pressure controller configured and arranged to control the pressure of gas or vapor in each channel, a leakby orifice or nozzle configured to provide a leak rate of gas or vapor from the channel; and a controller configured and arrange to determine the true flow information to each zone of the process tool so that the true leak rate in the chamber can be determined.
Opening claim text (preview).
What is claimed is: 1. A multiple zone pressure controller system for controlling the pressure of a gas or vapor flowing to at least two zones of a process tool, the system comprising: at least two channels configured and arranged to provide the flow of the gas or vapor to corresponding zones of the process tool, each channel including: a flow sensor configured and arranged to sense the flow of gas or vapor in the channel; and a leak-by orifice or nozzle configured to provide…
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