Bonded body of ceramic member and metal member and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9126384-B2
Application number	US-201314070862-A
Country	US
Kind code	B2
Filing date	Nov 4, 2013
Priority date	Nov 6, 2012
Publication date	Sep 8, 2015
Grant date	Sep 8, 2015

Abstract

A bonded body 10 includes a plate-shaped alumina or aluminum nitride ceramic member 12 and a Mo or Ti terminal 14 having a Ni coating, a Au coating, or a Ni—Au coating (Au on Ni) and joined to a recess 12 a in the ceramic member 12 with a joint layer 16 therebetween. The joint layer 16 contains Au, Ge, Ag, Cu, and Ti and is in contact with at least part of the side surfaces (herein the entire side surfaces) and the bottom surface of the recess 12 a . Ti is rich in the joint interface between the joint layer 16 and the ceramic member 12 . The percentage (porosity) of the sum of the cross-sectional areas of pores to the cross-sectional area of the joint layer 16 in a cross-section taken across the thickness of the bonded body 10 is 0.1% to 15%.

First claim

What is claimed is:

1. A bonded body comprising an alumina or aluminum nitride ceramic member and a metal member comprising Mo or Ti and having a Ni coating, a Au coating, or a Ni—Au coating, the metal member being joined to a recess in the ceramic member with a joint layer therebetween,
wherein the joint layer contains Au, Ge, Ag, Cu, and Ti and is in contact with a bottom surface and at least part of a side surface of the recess,
Ti is rich in one side of the joint layer, the one side being near a joint interface between the joint layer and the ceramic member, and
the percentage of the sum of the cross-sectional areas of pores to the cross-sectional area of the joint layer in a cross-section taken across the thickness of the bonded body is 0.1% to 15%.

2. The bonded body according to claim 1 , wherein Ti is aggregated around the pores present in the joint layer.

3. A method for manufacturing a bonded body, comprising the steps of:
(a) providing an alumina or aluminum nitride ceramic member having a recess;
(b) applying a Ag—Cu—Ti paste to a bottom surface and at least part of a side surface of the recess and heating the paste to 800° C. to 900° C. in a vacuum atmosphere to form a metallized layer on the bottom surface and at least part of the side surface of the recess; and
(c) setting a Au—Ge sheet on the bottom surface of the recess on which the metallized layer is formed, setting thereon a metal member comprising Mo or Ti and having a Ni coating, a Au coating, or a Ni—Au coating, and heating the components to 360° C. to 450° C. in a vacuum atmosphere to form a joint layer in which the metallized layer and the Au—Ge sheet are combined together between the metal member and the ceramic member,
wherein the joint layer contains Au, Ge, Ag, Cu, and Ti and is in contact with a bottom surface and at least part of a side surface of the recess,
Ti is rich in one side of the joint layer, the one side being near a joint interface between the joint layer and the ceramic member, and
the percentage of the sum of the cross-sectional areas of pores to the cross-sectional area of the joint layer in a cross-section taken across the thickness of the bonded body is 0.1% to 15%.

4. The method for manufacturing a bonded body according to claim 3 , wherein the metallized layer is formed with the thickness of 5 to 75 μm in step (b).

5. The method for manufacturing a bonded body according to claim 3 , the Ag—Cu—Ti paste used in step (b) contains 1.50% to 2.10% by weight of Ti.

Assignees

• Ngk Insulators Ltd

Inventors

• Minami Tomoyuki
• Kawajiri Tetsuya

Classifications

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title

• Y10T428/24917

  including metal layer · CPC title

• B32B7/045 Primary

  Operations & Transport · mapped topic

• B23K1/008 Primary

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• B32B15/08 Primary

  of synthetic resin · CPC title