Semiconductor device and methods of forming same
US-11935955-B2 · Mar 19, 2024 · US
US9123770B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123770-B2 |
| Application number | US-201314082582-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2013 |
| Priority date | Nov 18, 2013 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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An IGBT device includes one or more trench gates disposed over a semiconductor substrate and a floating body region of the first conductivity type disposed between two neighboring trench gates and between a semiconductor substrate and a heavily doped top region of the second conductivity type. A body region of the first conductivity type disposed over the top region has a doping concentration higher than that of the floating body region of the first conductivity type. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
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What is claimed is: 1. An insulating gate bipolar transistor (IGBT) device, comprising: a substrate including a bottom semiconductor layer of a first conductivity type and an upper semiconductor layer of a second conductivity type; one or more trench gates each formed in a corresponding trench disposed over the substrate, wherein the trench is provided with a gate insulator on each side of the trench and filled with polysilicon; a floating body region of the first conductivity…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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