Processing apparatus and device manufacturing method

Patent metadata

Field	Value
Publication number	US-9123760-B2
Application number	US-201313865911-A
Country	US
Kind code	B2
Filing date	Apr 18, 2013
Priority date	Jul 31, 2008
Publication date	Sep 1, 2015
Grant date	Sep 1, 2015

Abstract

A processing apparatus of the present invention processes for a wafer. The processing apparatus includes an XY stage which includes a wafer chuck which holds the wafer and an elevating device which rises relative to the wafer chuck to hold the wafer, and a wafer conveying robot hand which conveys the wafer from the XY stage at a wafer transfer position. The XY stage moves to change a direction at an angle between degree and degree via the wafer transfer position in a state where the elevating device rises relative to the wafer chuck. The wafer conveying robot hand has a shape which does not interfere with the XY stage which moves to change the direction at the angle when the wafer conveying hand is positioned at the wafer transfer position.

First claim

What is claimed is:

1. A processing apparatus configured to process a substrate, the apparatus comprising:
a movable stage which includes a chuck configured to hold the substrate and an elevating device configured to be risen relative to the chuck to hold the substrate;
a movable hand configured to convey the substrate in a moving direction from the movable stage at a transfer position; and
a controller configured to control operations of the movable stage and the movable hand…

Assignees

• Canon Kk

Inventors

• Hirano Shinichi
• Marumo Mitsuji

Classifications

• H10P72/3304

  Electricity · mapped topic

• H10P72/3302

  Electricity · mapped topic

• H10P72/30 Primary

  Electricity · mapped topic

• H01L21/67745

  Electricity · mapped topic

• H01L21/67742

  Electricity · mapped topic