Transistor, semiconductor device, and semiconductor structure
US-2024379874-A1 · Nov 14, 2024 · US
US9123750B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123750-B2 |
| Application number | US-201314016599-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 3, 2013 |
| Priority date | Dec 10, 2012 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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According to example embodiments, a transistor may include a gate electrode, a gate insulating layer, and a channel layer stacked on each other; and a source electrode and a drain electrode contacting first and second regions of the channel layer, respectively. The channel layer may include metal oxynitride. The first and second regions of the channel layer may be treated with a plasma containing hydrogen, and the first and second regions have a higher carrier concentration than a carrier concentration of a remaining region of the channel layer. The first and second regions of the channel layer may have a lower oxygen concentration and a higher nitrogen concentration than that of the remaining region thereof. The metal oxynitride of the channel layer may include a zinc oxynitride (ZnON)-based semiconductor.
Opening claim text (preview).
What is claimed is: 1. A transistor comprising: a gate electrode, a gate insulating layer, and a channel layer stacked on each other, the channel layer facing the gate electrode, the channel layer including metal oxynitride, the channel layer including first and second regions that are plasma treated regions and have a higher carrier concentration than a carrier concentration in a remaining region of the channel layer, the gate insulating layer between the channel layer and…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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