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Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
US9123734B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123734-B2 |
| Application number | US-201414168628-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2014 |
| Priority date | Jul 16, 2010 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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Abstract
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The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for producing a semiconductor device equipped with a semiconductor chip having a bump and a substrate having a metal interconnect, comprising a connection step of: (1) arranging the semiconductor chip and the substrate such that the bump and the metal interconnect face each other with a semiconductor-encapsulating adhesive interposed therebetween, the semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9123734B2 cover?
- The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.
- Who is the assignee on this patent?
- Hitachi Chemical Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W74/012. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).