Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Shielded package having shield lid
US9123718B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9123718-B1 |
| Application number | US-201314021604-A |
| Country | US |
| Kind code | B1 |
| Filing date | Sep 9, 2013 |
| Priority date | Nov 17, 2004 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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Abstract
Official abstract text for this publication.
A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: coupling an electronic component to a first substrate surface of a substrate; and enclosing the first substrate surface and the electronic component in an encapsulant, where the encapsulant comprises a first encapsulant surface coupled to the first substrate surface and a second encapsulant surface opposite the first encapsulant surface, and wherein: a first electrically conductive material comprising a first end connected to a first…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9123718B1 cover?
- A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached …
- Who is the assignee on this patent?
- Amkor Technology Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W74/01. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).