Structure to reduce chip shift during assembly
US-2024395758-A1 · Nov 28, 2024 · US
Method of sealing a glass envelope
US9123715B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123715-B2 |
| Application number | US-39353809-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 26, 2009 |
| Priority date | Feb 28, 2008 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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Abstract
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A method of hermetically sealing a glass assembly comprising glass plates or substrates with a glass-based frit when there is a large difference between the coefficient of thermal expansion (CTEs) of the frit and the CTEs of the glass plates. The method comprises a rapid increase of an irradiating heat source, used to heat and soften the frit, from a non-sealing power to a sealing power over a very short distance along the frit to form an initial stabilizing seal between the substrates.
First claim
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What is claimed is: 1. A method of forming a glass envelope for an electronic or optoelectronic device comprising: traversing a closed path over a surface of a glass assembly comprising first and second glass plates with a laser beam to heat a frit disposed between the first and second glass plates during a sealing process, the first and second glass plates having a coefficient of thermal expansion equal to or greater than about 50×10 −7 /° C. and the frit having a coefficient of…
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- What does patent US9123715B2 cover?
- A method of hermetically sealing a glass assembly comprising glass plates or substrates with a glass-based frit when there is a large difference between the coefficient of thermal expansion (CTEs) of the frit and the CTEs of the glass plates. The method comprises a rapid increase of an irradiating heat source, used to heat and soften the frit, from a non-sealing power to a sealing power over a …
- Who is the assignee on this patent?
- Russell Andrew Lawrence, Zhang Lu, Gu Yabei, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W95/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).