Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US9117971B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9117971-B2 |
| Application number | US-201313862784-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 15, 2013 |
| Priority date | Oct 15, 2009 |
| Publication date | Aug 25, 2015 |
| Grant date | Aug 25, 2015 |
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A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure may include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.
Opening claim text (preview).
What is claimed is: 1. A semiconductor light-emitting device, comprising: a conductive support member; a metal layer on the conductive support member; an electrode layer on the metal layer; a plurality of compound semiconductor layers on the electrode layer and at least comprising a first conductivity type semiconductor layer, an active layer on the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer on the active layer; a channe…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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