Semiconductor structure with flush shallow trench isolation and gate oxide and method of manufacturing the same
US-2024395883-A1 · Nov 28, 2024 · US
US9117900B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9117900-B2 |
| Application number | US-201414147484-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 3, 2014 |
| Priority date | Jan 6, 2013 |
| Publication date | Aug 25, 2015 |
| Grant date | Aug 25, 2015 |
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An RF LDMOS device is disclosed, including: a substrate having a first conductivity type; a channel doped region having the first conductivity type and a drift region having a second conductivity type, each in an upper portion of the substrate, the channel doped region having a first end in lateral contact with a first end of the drift region; a first well having the first conductivity type in the substrate, the first well having a top portion in contact with both of a bottom of the first end of the channel doped region and a bottom of the first end of the drift region; and a second well having the first conductivity type in the substrate, the second well having a top portion in contact with a bottom of a second end of the drift region. A method of forming such an RF LDMOS device is also disclosed.
Opening claim text (preview).
What is claimed is: 1. A radio frequency (RF) laterally diffused metal oxide semiconductor (LDMOS) device comprising: a substrate having a first conductivity type; a channel doped region having the first conductivity type and a drift region having a second conductivity type, each in an upper portion of the substrate, the channel doped region having a first end in lateral contact with a first end of the drift region; a first well having the first conductivity type in the substr…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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