Self-aligned barrier and capping layers for interconnects

Patent metadata

Field	Value
Publication number	US-9112005-B2
Application number	US-201313962856-A
Country	US
Kind code	B2
Filing date	Aug 8, 2013
Priority date	Oct 23, 2009
Publication date	Aug 18, 2015
Grant date	Aug 18, 2015

Abstract

An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces. Catalytic deposition of copper using a Mn, Cr, or V containing precursor and an iodine or bromine containing precursor is also provided.

First claim

We claim:

1. A process comprising:
depositing a metal containing layer from a vapor of a metal containing precursor, wherein the metal is selected from the group consisting of manganese, chromium and vanadium;
depositing an iodine or bromine containing material from a vapor of an iodine or bromine containing precursor, wherein the iodine or bromine containing material is chemisorbed on or in the metal containing layer; and
depositing a copper containing material from a vapor o…

Assignees

• Harvard College

Inventors

• Gordon Roy Gerald
• Bhandari Harish B
• Au Yeung
• Lin Youbo

Classifications

• H10P14/432

  Electricity · mapped topic

• H10P14/47

  Electricity · mapped topic

• H10P14/46

  Electricity · mapped topic

• H10P14/43 Primary

  Electricity · mapped topic

• H10P14/40

  Electricity · mapped topic