Self-aligned emitter-base-collector bipolar junction transistors with a single crystal raised extrinsic base

US9111986B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9111986-B2
Application numberUS-201414151225-A
CountryUS
Kind codeB2
Filing dateJan 9, 2014
Priority dateJan 9, 2014
Publication dateAug 18, 2015
Grant dateAug 18, 2015

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Abstract

Official abstract text for this publication.

Fabrication methods, device structures, and design structures for a bipolar junction transistor. An intrinsic base layer is formed on a semiconductor substrate, an etch stop layer is formed on the intrinsic base layer, and an extrinsic base layer is formed on the etch stop layer. A trench is formed that penetrates through the extrinsic base layer to the etch stop layer. The trench is formed by etching the extrinsic base layer selective to the etch stop layer. The first trench is extended through the etch stop layer to the intrinsic base layer by etching the etch stop layer selective to the intrinsic base layer. After the trench is extended through the etch stop layer, an emitter is formed using the trench.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a device structure for a bipolar junction transistor, the method comprising: forming an intrinsic base layer on a semiconductor substrate; forming an etch stop layer on the intrinsic base layer; forming an extrinsic base layer on the etch stop layer; forming a first trench penetrating through the extrinsic base layer to the etch stop layer by etching the extrinsic base layer selective to the etch stop layer; forming a second trenc…

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What does patent US9111986B2 cover?
Fabrication methods, device structures, and design structures for a bipolar junction transistor. An intrinsic base layer is formed on a semiconductor substrate, an etch stop layer is formed on the intrinsic base layer, and an extrinsic base layer is formed on the etch stop layer. A trench is formed that penetrates through the extrinsic base layer to the etch stop layer. The trench is formed by …
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10D10/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).