Semiconductor device
US-2024079448-A1 · Mar 7, 2024 · US
US9111985B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9111985-B1 |
| Application number | US-65278507-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jan 11, 2007 |
| Priority date | Jan 11, 2007 |
| Publication date | Aug 18, 2015 |
| Grant date | Aug 18, 2015 |
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A shallow bipolar junction transistor comprising a high voltage n+ well implanted into a semiconductor substrate. The shallow bipolar junction transistor further comprises a bit line n+ implant (BNI) above the high voltage n+ well and an oxide nitride (ONO) layer above the high voltage n+ well. A portion of the ONO layer isolates the BNI from a shallow trench isolation (STI) region.
Opening claim text (preview).
What is claimed is: 1. A shallow bipolar junction transistor comprising: a high voltage n+ well implanted into a semiconductor substrate; an oxide nitride oxide (ONO) layer, an n+ collector, and a bit line residual oxide removal (BLROE)/spacer over etch (SPXOE) layer above said high voltage n+ well; a bit line n+ implant (BNI) above said high voltage n+ well, wherein a portion of said ONO layer is formed around a portion of said BNI; a plurality of emitters in a central region of the transistor, a base laterally separated from the plurality of emitters, and an n+ core implant surrounding the plurality of emitters to isolate the base and the plurality of emitters, wherein the n+ core implant defines a difference between said base and an emitter; a high voltage gate oxide (HVGOX) above said n+ collector and around said base; and a p+ source/drain implant (PP) layer around said base. 2. The shallow bipolar junction transistor of claim 1 wherein said oxide nitride oxide (ONO) layer is at a periphery area of said BNI. 3. The shallow bipolar junction transistor of claim 1 further comprising a shallow trench isolation (STI) region proximate to said ONO layer. 4. The shallow bipolar junction transistor of claim 1 wherein said bit line n+ implant is at a periphery area of said plurality of emitters. 5. The shallow bipolar junction transistor of claim 4 further comprising an n+ implant for isolating a base and emitters of said shallow bipolar junction transistor. 6. The shallow bipolar junction transistor of claim 1 further comprising an emitter wherein a portion of said emitter is operable to operate as a contact. 7. The shallow bipolar junction transistor of claim 6 wherein said portion of said emitter is operable to operate as a contact without a cobalt silicide (CoSi) layer.
Emitter regions of BJTs · CPC title
Base electrodes for bipolar transistors · CPC title
Emitter or collector electrodes for bipolar transistors · CPC title
PN junction isolations · CPC title
of lateral BJTs (of heterojunction BJTs H10D10/021; of thin film BJTs H10D10/041) · CPC title
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