Elastic retention wheels and wafer adapter containing the same wheels

US9111973B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9111973-B2
Application numberUS-201213622869-A
CountryUS
Kind codeB2
Filing dateSep 19, 2012
Priority dateSep 29, 2011
Publication dateAug 18, 2015
Grant dateAug 18, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An elastic retention wheel and a wafer adapter containing this wheel are disclosed. The elastic retention wheel comprises: a rim; a retention main body positioned within the rim; and a plurality of spokes. Each spoke is positioned in a space between the rim and the retention main body. One end of each spoke is coupled to the retention main body, and the other end is coupled to the rim. A sliding rail can be provided on an inner side of the rim, and the spoke's other end can slide with the sliding rail. When the elastic retention wheel is stressed by a non-uniform or excessive external force, these spokes provide enhanced support from the rim's inner side, or at least partially disperse the non-uniform external force applied to the elastic retention wheel. Thereby, the elastic retention wheel is largely kept from over-deformation or cracking.

First claim

Opening claim text (preview).

What is claimed is: 1. An elastic retention wheel adapted for use in a wafer adapter, the elastic retention wheel comprising: a rim; a retention main body, the retention main body being positioned within the rim and integrally formed with the rim, the retention main body and at least a portion of the rim being separated from each other by a space; and a plurality of spokes, each spoke positioned within the space, each spoke further having a first end coupled to the retention m…

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What does patent US9111973B2 cover?
An elastic retention wheel and a wafer adapter containing this wheel are disclosed. The elastic retention wheel comprises: a rim; a retention main body positioned within the rim; and a plurality of spokes. Each spoke is positioned in a space between the rim and the retention main body. One end of each spoke is coupled to the retention main body, and the other end is coupled to the rim. A slidin…
Who is the assignee on this patent?
Semiconductor Mfg Int Shanghai, Semiconductor Mfg Int Beijing, Semiconductor Mfg Int Corp, and 1 more
What technology area does this patent fall under?
Primary CPC classification H10P72/1921. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).