Packages with electrical fuses
US-2024332243-A1 · Oct 3, 2024 · US
Semiconductor device
US9111920B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9111920-B2 |
| Application number | US-201313963804-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 9, 2013 |
| Priority date | Mar 9, 2011 |
| Publication date | Aug 18, 2015 |
| Grant date | Aug 18, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor device includes: a die pad comprised of a metal, and having at least one cutout portion in its peripheral edge portion, and a protruding portion formed by the cutout portion so as to protrude laterally from the peripheral edge portion; an inner lead having at its end a bonding pad that is placed in the cutout portion with an interval between the bonding pad and the die pad; a semiconductor chip held on the die pad so that a center position of the semiconductor chip is located on the protruding portion side with respect to a center position of the die pad; and a wire configured to electrically connect the semiconductor chip to the bonding pad.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a die pad comprised of a metal, and having at least one cutout portion in its peripheral edge portion, and a protruding portion formed by the cutout portion so as to protrude laterally from the peripheral edge portion; a first inner lead having at its end a bonding pad that is placed in the cutout portion with an interval between the bonding, pad and the die pad; a semiconductor chip held on the die pad so that a cente…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W70/465Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9111920B2 cover?
- A semiconductor device includes: a die pad comprised of a metal, and having at least one cutout portion in its peripheral edge portion, and a protruding portion formed by the cutout portion so as to protrude laterally from the peripheral edge portion; an inner lead having at its end a bonding pad that is placed in the cutout portion with an interval between the bonding pad and the die pad; a se…
- Who is the assignee on this patent?
- Panasonic Corp, Panasonic Intellectual Property Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/465. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).