Semiconductor memory device and manufacturing method of semiconductor memory device
US-2024313073-A1 · Sep 19, 2024 · US
US9111908B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9111908-B2 |
| Application number | US-201213448531-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 17, 2012 |
| Priority date | Mar 21, 2011 |
| Publication date | Aug 18, 2015 |
| Grant date | Aug 18, 2015 |
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Embodiments include a split-gate non-volatile memory cell that is formed having a control gate and a select gate, where at least a portion of the control gate is formed over the select gate. A charge storage layer is formed between the select gate and the control gate. The select gate is formed using a first conductive layer and a second conductive layer. The second conductive layer is formed over the first conductive layer and has a lower resistivity than the first conductive layer. In one embodiment, the first conductive layer is polysilicon and the second conductive layer is titanium nitride (TiN). In another embodiment, the second conductive layer may be a silicide or other conductive material, or combination of conductive materials having a lower resistivity than the first conductive layer.
Opening claim text (preview).
What is claimed is: 1. A split-gate non-volatile memory (NVM) cell, comprising: a first gate over a substrate, wherein the first gate is formed from a first conductive layer; a second conductive layer over the first gate; a dielectric charge storage layer over the second conductive layer and the substrate, wherein the dielectric later charge storage layer overlaps a first sidewall of the first gate; and a second gate over the dielectric charge storage layer, wherein the seco…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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