Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing wiring board

Patent metadata

Field	Value
Publication number	US-9110371-B2
Application number	US-201314403233-A
Country	US
Kind code	B2
Filing date	May 28, 2013
Priority date	May 31, 2012
Publication date	Aug 18, 2015
Grant date	Aug 18, 2015

Abstract

Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.

First claim

The invention claimed is:

1. A photosensitive resin composition, comprising:
a binder polymer;
a photopolymerizable compound having an ethylenically unsaturated group;
a photopolymerization initiator;
a benzotriazole compound; and
an aliphatic diamine compound having from 8 to 30 carbon atoms.

2. The photosensitive resin composition according to claim 1 , further comprising at least one selected from the group consisting of triazole compounds and tetrazole compounds.

3. A photosensitive element, comprising:
a support; and
a photosensitive layer that is formed on the support and is a coating film composed of the photosensitive resin composition according to claim 2 .

4. A method of forming a resist pattern, the method comprising:
a lamination step of laminating the photosensitive element according to claim 3 on a substrate such that the photosensitive layer faces the substrate;
an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured portion in the photosensitive layer; and
a development step of removing a portion other than the photo-cured portion.

5. A method of forming a resist pattern, the method comprising:
a photosensitive layer-forming step of forming a photosensitive layer on a substrate by applying the photosensitive resin composition according to claim 2 .

6. A photosensitive element, comprising:
a support; and
a photosensitive layer that is formed on the support and is a coating film composed of the photosensitive resin composition according to claim 1 .

7. A method of forming a resist pattern, the method comprising:
a lamination step of laminating the photosensitive element according to claim 6 on a substrate such that the photosensitive layer faces the substrate;
an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured portion in the photosensitive layer; and
a development step of removing a portion other than the photo-cured portion.

8. A method of producing a wiring board, the method comprising a step of performing an etching treatment or a plating treatment on a substrate on which a resist pattern is formed by the method of forming a resist pattern according to claim 7 .

9. A method of forming a resist pattern, the method comprising:
a photosensitive layer-forming step of forming a photosensitive layer on a substrate by applying the photosensitive resin composition according to claim 1 ;
an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured portion in the photosensitive layer; and
a development step of removing a portion other than the photo-cured portion.

10. A method of producing a wiring board, the method comprising a step of performing an etching treatment or a plating treatment on a substrate on which a resist pattern is formed by the method of forming a resist pattern according to claim 9 .

Assignees

• Hitachi Chemical Co Ltd
• Hitachi Chemical Co Ltd

Inventors

• Itagaki Katsutoshi
• Shindou Masanori

Classifications

• G03F7/085 Primary

  Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives (G03F7/075 takes precedence) · CPC title

• H05K3/064

  Photoresists · CPC title

• H05K3/108

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title