System and methods for passive alignments of light transmitting or receiving devices to planar waveguides
US-2024295705-A1 · Sep 5, 2024 · US
Optical module and optical transmission module
US9110261B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9110261-B2 |
| Application number | US-201213679091-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 16, 2012 |
| Priority date | Jan 19, 2012 |
| Publication date | Aug 18, 2015 |
| Grant date | Aug 18, 2015 |
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Abstract
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An optical module is provided in which at least one of a surface light emitting device and a surface light receiving device is mounted on a positioning component on which optical fibers are positioned and mounted. The positioning component is made of an insulating resin and a plurality of lead frames that provide electrical connection are molded integrally with the positioning component. Each of the lead frames is flat plate and the plate surface of each of the lead frames serves as a first electrical connection surface and an edge face of each of the lead frames serves as a second electrical connection surface. The interconnection structure is simple and linear and is advantageous in high-frequency signal transmission.
First claim
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What is claimed is: 1. An optical module in which an optical device that is at least one of a surface light emitting device and a surface light receiving device is mounted on a positioning component on which an optical fiber is to be positioned and mounted, wherein: the positioning component is made of an insulating resin and a plurality of lead frames providing electrical connection are molded integrally with the positioning component; and each of the lead frames is in a form o…
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Frequently asked questions
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- What does patent US9110261B2 cover?
- An optical module is provided in which at least one of a surface light emitting device and a surface light receiving device is mounted on a positioning component on which optical fibers are positioned and mounted. The positioning component is made of an insulating resin and a plurality of lead frames that provide electrical connection are molded integrally with the positioning component. Each o…
- Who is the assignee on this patent?
- Japan Aviation Electron
- What technology area does this patent fall under?
- Primary CPC classification G02B6/423. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).