Semiconductor structure including optical device and method for manufacturing the same
US-2024230996-A1 · Jul 11, 2024 · US
Coupling optical signals into silicon optoelectronic chips
US9109948B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9109948-B2 |
| Application number | US-201414513886-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 14, 2014 |
| Priority date | Nov 6, 2008 |
| Publication date | Aug 18, 2015 |
| Grant date | Aug 18, 2015 |
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Abstract
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A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip in a photonic transceiver, wherein photonic, electronic, or optoelectronic devices may be integrated in layers on a front surface of the CMOS photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface. The optical signals may be coupled into the back surface of the chips via optical fibers and/or optical source assemblies. The optical signals may be coupled to the optical couplers via a light path etched in the chips, which may be refilled with silicon dioxide. The chips may be bonded to a second chip. Optical signals may be reflected back to the optical couplers via metal reflectors, which may be integrated in dielectric layers on the chips.
First claim
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What is claimed is: 1. A method for processing signals, the method comprising: in a photonic transceiver comprising a CMOS photonic chip, coupling one or more optical signals into a back surface of said CMOS photonic chip, wherein photonic, electronic, or optoelectronic devices are integrated in layers on a front surface of said CMOS photonic chip and said one or more optical signals are received by one or more optical couplers integrated in said layers on said front surface of s…
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- G02B6/124Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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- What does patent US9109948B2 cover?
- A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip in a photonic transceiver, wherein photonic, electronic, or optoelectronic devices may be integrated in layers on a front surface of the CMOS photonic chip. Optical couplers, such as grating couplers, ma…
- Who is the assignee on this patent?
- Luxtera Inc
- What technology area does this patent fall under?
- Primary CPC classification G02B6/124. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).