Implant material, implant component, implant component manufacturing method, laser machining method, and laser machining apparatus

US9107977B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9107977-B2
Application numberUS-201113881998-A
CountryUS
Kind codeB2
Filing dateOct 27, 2011
Priority dateOct 29, 2010
Publication dateAug 18, 2015
Grant dateAug 18, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a hydroxyapatite to be joined to another hydroxyapatite or a bone by laser machining (machining of the bone and the hydroxyapatite includes irradiation of laser light on the bone and irradiation of laser light on the hydroxyapatite), to prevent occurrence of a fracture in a junction and in a peripheral portion of the junction during laser machining, the present invention provides an optimum weight ratio of a cordierite or quartz glass component mixed in the hydroxyapatite. As a mixing ratio of the cordierite or quartz glass component, the cordierite or quartz glass component is mixed at least at a weight ratio equal to or higher than 25.7%.

First claim

Opening claim text (preview).

The invention claimed is: 1. An implant material used for manufacturing of an artificial bone and an artificial tooth root, wherein a quartz glass, or a mixture of a cordierite and the quartz glass is mixed in a hydroxyapatite at least at a weight ratio equal to or higher than 25.7%. 2. The implant material according to claim 1 , wherein the weight ratio of the quartz glass, or the mixture of the cordierite and the quartz glass is increased according to pred…

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What does patent US9107977B2 cover?
In a hydroxyapatite to be joined to another hydroxyapatite or a bone by laser machining (machining of the bone and the hydroxyapatite includes irradiation of laser light on the bone and irradiation of laser light on the hydroxyapatite), to prevent occurrence of a fracture in a junction and in a peripheral portion of the junction during laser machining, the present invention provides an optimum …
Who is the assignee on this patent?
Kanaoka Masaru, Ogita Taira, Tadano Shigeru, and 2 more
What technology area does this patent fall under?
Primary CPC classification A61L27/10. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).