Electronic device including noise inducing structure
US-11978950-B2 · May 7, 2024 · US
US9107326B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9107326-B2 |
| Application number | US-201414151150-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 9, 2014 |
| Priority date | Feb 4, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.
Opening claim text (preview).
What is claimed is: 1. An electronics assembly, comprising: a first finned structure having a first support plate and a plurality of substantially vertical first fins extending from a surface of the first support plate; a first electronics module mounted to an opposite surface of the first support plate; a second finned structure having a second support plate and a plurality of substantially vertical second fins extending from a surface of the second support plate, wherein the…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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