Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
US9107323B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9107323-B2 |
| Application number | US-201113811528-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2011 |
| Priority date | Jul 22, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Official abstract text for this publication.
A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.
Opening claim text (preview).
The invention claimed is: 1. A bandpass filter module comprising: a mounting board capable of mounting a filter chip on a surface thereof; and a filter chip mounted on the surface of said mounting board, wherein said mounting board comprises one or more internal wiring layers; said filter chip includes three or more resonators connected between an input terminal and an output terminal for forming a predetermined pass band; said filter chip includes a chip middle zone defin…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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