Band-pass filter module and module substrate

US9107323B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9107323-B2
Application numberUS-201113811528-A
CountryUS
Kind codeB2
Filing dateJul 21, 2011
Priority dateJul 22, 2010
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

First claim

Opening claim text (preview).

The invention claimed is: 1. A bandpass filter module comprising: a mounting board capable of mounting a filter chip on a surface thereof; and a filter chip mounted on the surface of said mounting board, wherein said mounting board comprises one or more internal wiring layers; said filter chip includes three or more resonators connected between an input terminal and an output terminal for forming a predetermined pass band; said filter chip includes a chip middle zone defin…

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What does patent US9107323B2 cover?
A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone.…
Who is the assignee on this patent?
Tomaki Shigemitsu, Tsuya Yoshikazu, Tanaka Masamichi, and 2 more
What technology area does this patent fall under?
Primary CPC classification H05K1/18. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).