Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
Multi-layer micro-wire substrate structure
US9107316B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9107316-B2 |
| Application number | US-201314023740-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 11, 2013 |
| Priority date | Sep 11, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
Official abstract text for this publication.
A multi-layer micro-wire structure includes a substrate having a substrate edge. A first layer is formed over the substrate extending to a first layer edge. One or more first micro-channels are imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer. A second layer is formed over the first layer extending to a second layer edge. One or more second micro-channels are imprinted in the second layer, at least one imprinted second micro-channel having a micro-wire forming at least a portion of an exposed second connection pad in the second layer. The second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A multi-layer micro-wire structure, comprising: a substrate having a substrate edge; a first layer formed over the substrate extending to a first layer edge; one or more first micro-channels imprinted in the first layer, at least one imprinted first micro-channel having a first micro-wire forming at least a portion of an exposed first connection pad in the first layer; a second layer formed over the first layer extending to a second layer edge;…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/117Primary
Electricity · mapped topic
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- What does patent US9107316B2 cover?
- A multi-layer micro-wire structure includes a substrate having a substrate edge. A first layer is formed over the substrate extending to a first layer edge. One or more first micro-channels are imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer. A second layer is formed ove…
- Who is the assignee on this patent?
- Cok Ronald Steven, Eastman Kodak Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/117. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).