Resonant via structures in multilayer substrates and filters based on these via structures

Patent metadata

Field	Value
Publication number	US-9107300-B2
Application number	US-200913515840-A
Country	US
Kind code	B2
Filing date	Dec 14, 2009
Priority date	Dec 14, 2009
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.

First claim

The invention claimed is:

1. A resonant via structure, comprising:
a multilayer substrate, including a plurality of conductor layers and a dielectric isolating each of said plurality of conductor layers;
a signal via conductor, disposed through said multilayer substrate; and
a plurality of ground vias, disposed through said multilayer substrate and around said signal via conductor,
wherein said plurality of conductor layers comprise:
a first plurality of signal conductive p…

Assignees

• Kushta Taras
• Nec Corp

Inventors

• Kushta Taras

Classifications

• H05K2201/09618

  Electricity · mapped topic

• H01P1/203

  Electricity · mapped topic

• H05K3/429

  Electricity · mapped topic

• H05K1/116

  Electricity · mapped topic

• H05K1/162

  Electricity · mapped topic