Splice box
US-9225098-B2 · Dec 29, 2015 · US
Die assembly and crimping method
US9106040B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9106040-B2 |
| Application number | US-201113808623-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 14, 2011 |
| Priority date | Jul 15, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
In the invention, an upper die ( 18 ) includes an anti-extrusion projection ( 17 ) that projects toward a signal conductor ( 14 ) placed on an upper side of a terminal forming piece ( 12 ) loaded on a lower die ( 19 ) and a die inner wall surface ( 18 a ) that situated on either side of the anti-extrusion projection ( 17 ) and that folds the terminal forming piece ( 12 ). When the terminal forming piece ( 12 ) is crimped to the signal conductor ( 14 ) by means of the upper die ( 18 ) and the lower die ( 19 ), the anti-extrusion projection ( 17 ) presses the signal conductor ( 14 ) downward, and the die inner wall surfaces ( 18 a ) fold the terminal forming piece ( 12 ) such that both ends of the terminal forming piece ( 12 ) come close to the anti-extrusion projection ( 17 ).
First claim
Opening claim text (preview).
The invention claimed is: 1. A die assembly, comprising: an upper die and a lower die for crimping a terminal forming piece of a chained terminal to a signal conductor at a portion of an electric wire, the chained terminal having a carrier and the terminal forming pieces continually provided at multiple locations on the carrier in its longitudinal direction; wherein the upper die includes: a pushing means for pushing the signal conductor downward during crimping, the pushing me…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H01R4/184Primary
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9106040B2 cover?
- In the invention, an upper die ( 18 ) includes an anti-extrusion projection ( 17 ) that projects toward a signal conductor ( 14 ) placed on an upper side of a terminal forming piece ( 12 ) loaded on a lower die ( 19 ) and a die inner wall surface ( 18 a ) that situated on either side of the anti-extrusion projection ( 17 ) and that folds the terminal forming piece ( 12 ). When the terminal fo…
- Who is the assignee on this patent?
- Morikawa Taishi, Yazaki Corp
- What technology area does this patent fall under?
- Primary CPC classification H01R4/184. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).