High frequency line to waveguide converter comprising first and second dielectric layers sandwiching an antenna with an adhesion layer

Patent metadata

Field	Value
Publication number	US-9105953-B2
Application number	US-201213607328-A
Country	US
Kind code	B2
Filing date	Sep 7, 2012
Priority date	Sep 30, 2011
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A high frequency line-waveguide converter is provided which includes a first substrate including a first dielectric layer, a first conductive layer formed on a surface of the first dielectric layer, and a conductive pattern formed on the surface of the first dielectric layer that surrounds the second conductive layer. An antenna formed on a bottom surface of the first dielectric layer at a fixed interval from the second conductive layer. The high frequency line-waveguide converter also includes a second substrate including a third conductive layer and a fourth conductive layer separated by a second dielectric layer. An adhesion layer formed between the first substrate and second substrate, a shield conductive part formed by multiple vias between the conductive pattern and the fourth conductive layer, and a conductive waveguide in contact with the fourth conductive layer.

First claim

What is claimed is:

1. A high frequency line-waveguide converter, comprising:
a first substrate including:
a first dielectric layer,
a first conductive layer disposed on an upper surface of the first dielectric layer,
a second conductive layer disposed on a lower surface of the first dielectric layer, and
a conductive pattern formed on the upper surface of the first dielectric layer so as to surround the first conductive layer with a defined gap therebetween;

a second s…

Assignees

• Gomi Koichiro
• Toshiba Kk

Inventors

• Gomi Koichiro

Classifications

• H01P5/107 Primary

  Electricity · mapped topic