Display device and method for fabricating the same
US-2024363819-A1 · Oct 31, 2024 · US
Method for forming a patterned layer on a substrate
US9105867B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105867-B2 |
| Application number | US-66683808-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 30, 2008 |
| Priority date | Jul 4, 2007 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
This invention relates to a method for forming a patterned layer on a substrate by means of an imprint process. According to the method a first layer is provided on the substrate, and a pattern of recesses is provided in the first layer by imprinting the layer with a patterning means. Then the first layer is cured. The curing is followed by performing a first surface treatment onto the first layer to make the surface of thereof hydrophilic, and then performing a second surface treatment onto a selected subarea of the surface of the first layer to make the. subarea hydrophobic. The subarea includes surface portions between the recesses and excludes the recesses. Finally, a conducting pattern material ( 41 ) is deposited into the recesses.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for forming a patterned layer on a substrate by means of an imprint process comprising the steps of: providing a single patterning means; providing a first layer on a surface of said substrate; simultaneously forming patterns of recesses in the first layer by imprinting said first layer with said patterning means, wherein said patterns of recesses includes a first pattern of recesses and a second pattern of recesses that are wider than sai…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10K71/00Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9105867B2 cover?
- This invention relates to a method for forming a patterned layer on a substrate by means of an imprint process. According to the method a first layer is provided on the substrate, and a pattern of recesses is provided in the first layer by imprinting the layer with a patterning means. Then the first layer is cured. The curing is followed by performing a first surface treatment onto the first la…
- Who is the assignee on this patent?
- Verschuuren Marcus Antonius, Lifka Herbert, Tanase Cristina, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10K71/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).