Capacitive micro-machined transducer and method of manufacturing the same
US-9231496-B2 · Jan 5, 2016 · US
Forming magnetic microelectromechanical inductive components
US9105841B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105841-B2 |
| Application number | US-201313796496-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2013 |
| Priority date | Mar 12, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
Official abstract text for this publication.
A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a micro-electromechanical device, comprising: depositing a sacrificial layer on a wafer; forming a metal layer of the micro-electromechanical device on the sacrificial layer; removing the sacrificial layer to produce a suspended metal beam coupled to at least one support structure of the wafer; and electrolessly depositing a soft magnetic material on the metal layer to manufacture the micro-electromechanical device.…
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Electricity · mapped topic
Electricity · mapped topic
- B81C1/00373Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Electricity · mapped topic
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- What does patent US9105841B2 cover?
- A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silico…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification B81C1/00373. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).