Moisture curable compositions
US-2024400829-A1 · Dec 5, 2024 · US
Material for a molded resin for use in a semiconductor light-emitting device
US9105822B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105822-B2 |
| Application number | US-201314100096-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2013 |
| Priority date | Dec 22, 2009 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b): (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 μm or more and 2.0 μm or less.
First claim
Opening claim text (preview).
The invention claimed is: 1. A material for a molded resin, comprising (A) a polyorganosiloxane, (B) a white pigment, (C) a curing catalyst, (D), a cure rate controlling agent, and (E) a fluidity controlling agent, wherein the polyorganosiloxane (A) is a thermosetting polyorganosiloxane that is a liquid at normal temperature and normal pressure, the polyorganosiloxane (A) comprises an addition polyorganosiloxane represented by the following general formula (2) R n…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9105822B2 cover?
- The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device.…
- Who is the assignee on this patent?
- Mitsubishi Chem Corp
- What technology area does this patent fall under?
- Primary CPC classification C08L83/04. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).