Printed circuit board module and electronic device
US-2024260184-A1 · Aug 1, 2024 · US
Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board
US9105819B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105819-B2 |
| Application number | US-201213450097-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 18, 2012 |
| Priority date | May 1, 2009 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.
First claim
Opening claim text (preview).
We claim: 1. A method of manufacturing an electronic apparatus, the electronic apparatus comprising a circuit board, the method comprising: mounting at least one semiconductor component on the circuit board; locating at least one trace or conductor on the circuit board and operably coupling the at least one trace or conductor to the at least one semiconductor component; operably coupling the at least one trace or conductor to a connection arrangement mounted on the circuit boa…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9105819B2 cover?
- In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circ…
- Who is the assignee on this patent?
- Sekowski Daniel, Carpenter Frederick Lloyd, Hand Mark Anthony, and 8 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/284. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).