Method of forming deposited patterns on a surface

US9105800B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9105800-B2
Application numberUS-201314100048-A
CountryUS
Kind codeB2
Filing dateDec 9, 2013
Priority dateDec 9, 2013
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities, each cavity having outer, peripheral sidewalls extending outwardly from the surface. The method includes: providing a structure having a release agent thereon; contacting top surface of the wafer with the release agent to transfer portions of the release agent to the top surface of the wafer while bottom portions of the cavities remain spaced from the release agent to produce an intermediate structure; the release agent disposed on the top surface of the wafer and with the bottom portions of the cavities void of the release agent; exposing the intermediate structure to the material to blanket coat the material on both the release agent and the bottom portions of the cavities; and selectively removing the release agent together with the coating material while leaving the coating material on the bottom portions of the cavities.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming a coating of a material on selected portions of a substrate having a plurality of cavities formed in selected portions of a surface of the substrate, each cavity having outer, peripheral sidewalls extending outwardly from the cavity floor, comprising: providing a structure having a release agent thereon; contacting a top surface of the substrate with the release agent to transfer portions of the release agent to the top surface of the…

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What does patent US9105800B2 cover?
A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities, each cavity having outer, peripheral sidewalls extending outwardly from the surface. The method includes: providing a structure having a release agent thereon; contacting top surface of the wafer with the release agent to transfer portions of the release agent to the top s…
Who is the assignee on this patent?
Raytheon Co
What technology area does this patent fall under?
Primary CPC classification B81C1/00373. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).