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Adhesive film, method of manufacturing semiconductor device, and semiconductor device
US9105754B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105754-B2 |
| Application number | US-201313929612-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 27, 2013 |
| Priority date | Jun 28, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
Provided is an adhesive film that enables manufacturing of a high quality semiconductor device with good yield ratio, and related methods of manufacturing a semiconductor device, and semiconductor devices. Provided is an adhesive film for embedding a first semiconductor element fixed to an adherend and fixing a second semiconductor element that is different from the first semiconductor element to the adherend, wherein the adhesive film has a thickness T that is larger than a thickness T 1 of the first semiconductor element, and the adherend and the first semiconductor element are connected by wire bonding and a difference between the thickness T and the thickness T 1 is 40 μm or more and 260 μm or less, or the adherend and the first semiconductor element are connected by flip-chip bonding and a difference between the thickness T and the thickness T 1 is 10 μm or more and 200 μm or less.
First claim
Opening claim text (preview).
What is claimed is: 1. An adhesive film for embedding a first semiconductor element fixed to an adherend and fixing a second semiconductor element that is different from the first semiconductor element to the adherend, wherein the adhesive film has a thickness T that is larger than a thickness T 1 of the first semiconductor element, the adhesive film comprises an epoxy resin and a phenol resin, and the adherend and the first semiconductor element are connected by wire bonding…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9105754B2 cover?
- Provided is an adhesive film that enables manufacturing of a high quality semiconductor device with good yield ratio, and related methods of manufacturing a semiconductor device, and semiconductor devices. Provided is an adhesive film for embedding a first semiconductor element fixed to an adherend and fixing a second semiconductor element that is different from the first semiconductor element …
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W74/114. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).