Integrated Assemblies Having Conductive Posts Extending Through Stacks of Alternating Materials
US-2024237336-A9 · Jul 11, 2024 · US
US9105740B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105740-B2 |
| Application number | US-201314105041-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2013 |
| Priority date | May 15, 2008 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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A method for fabricating a nonvolatile charge trap memory device is described. The method includes forming a first oxide layer on a surface of a substrate. The first oxide layer is exposed to a first decoupled plasma nitridation process having a first bias. Subsequently, a charge-trapping layer is formed on the first oxide layer. The charge-trapping layer is exposed to an oxidation process and then to a second decoupled plasma nitridation process having a second, different, bias.
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What is claimed is: 1. A nonvolatile charge trap memory device, comprising: a tunnel dielectric layer on a surface of a substrate, the tunnel dielectric layer comprising a nitrided first oxide layer formed by a first decoupled plasma nitridation process; a charge-trapping layer on the tunnel dielectric layer; and a blocking dielectric layer on the charge-trapping layer, the blocking dielectric layer formed by a second decoupled plasma nitridation process.…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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