Multigate metal oxide semiconductor devices and fabrication methods

US9105719B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9105719-B2
Application numberUS-201313737682-A
CountryUS
Kind codeB2
Filing dateJan 9, 2013
Priority dateJan 9, 2013
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A semiconductor device includes a first well and a second well implanted in a semiconductor substrate. The semiconductor device further includes a gate structure above the first and second wells between a raised source structure and a raised drain structure. The raised source structure above is in contact with the first well and connected with the gate structure through a first semiconductor fin structure. The raised drain structure above and in contact with the second well and connected with a second semiconductor fin structure. The second semiconductor fin structure includes at least a gap and a lightly doped portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device, comprising: a first well implanted in a semiconductor substrate; a second well implanted in the semiconductor substrate; a gate structure above the first and second wells; a raised source structure above and in contact with the first well and connected with the gate structure through a first semiconductor fin structure; and a raised drain structure above and in contact with the second well and connected with a second semicondu…

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What does patent US9105719B2 cover?
A semiconductor device includes a first well and a second well implanted in a semiconductor substrate. The semiconductor device further includes a gate structure above the first and second wells between a raised source structure and a raised drain structure. The raised source structure above is in contact with the first well and connected with the gate structure through a first semiconductor fi…
Who is the assignee on this patent?
Broadcom Corp
What technology area does this patent fall under?
Primary CPC classification H10D30/62. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).