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Semiconductor devices that include a die bonded to a substrate with a gold interface layer
US9105599B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105599-B2 |
| Application number | US-201414287141-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 26, 2014 |
| Priority date | Jan 7, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a primary portion of a substrate; a die; and a die attach layer between the die and the primary portion of the substrate, the die attach layer comprising a gold interface layer that includes gold and a plurality of first precipitates in the gold, wherein each of the plurality of first precipitates comprises a combination of nickel, cobalt, palladium, gold, and silicon. 2. The semiconductor device a…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9105599B2 cover?
- Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
- Who is the assignee on this patent?
- Freescale Semiconductor Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W76/157. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).